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Omni Design Technologies

Physical Design Lead/Manager

Job Posted 7 Days Ago Posted 7 Days Ago
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Hybrid
2 Locations
Senior level
Hybrid
2 Locations
Senior level
Lead and manage physical design implementation of mixed-signal SOCs for automotive and space applications, ensuring high-quality execution and team collaboration.
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Omni Design is working on exciting solutions and chips for next generation automotive and space applications and looking for talented and capable engineers.


Omni Design is developing exciting high-speed Mixed-Signal SOC. We are looking for a Lead/Manager of Physical Design to make these high performance Mixed-Signal SOCs a reality

Role and Responsibility

  • Own and drive the physical implementation of next-generation Mixed-Signal SOC with HS ADC/DAC, HS interfaces like PCIe, LPDDR, MIPI, USB2/3, Gig Ethernet etc.
  • Understand the requirements and define physical implementation methodologies.
  • Collaborate with architecture, design, front end and CAD teams to deliver high-quality physical designs.
  • Implement and verify designs at all levels of hierarchy in the SOC.
  • Interact with foundry over matters of technology, schedule, and signoff 

Qualifications and Experience

  • BSEE Required, MSEE Preferred
  • 8+ years of experience of physical design in SOCs.
  • 3+ years of experience in managing projects and leading teams.
  • Hands-on expertise in all of the following areas: Floorplanning, Power planning, Implementation of UPF Methodology, Logic and clock tree synthesis, Placement , Timing Closure, Routing, Extraction, Physical Verification (DRC & LVS), Crosstalk Analysis, EM/IR
  • Full chip/ top-level expertise in multiple chip tape-outs.
  • Good understanding and experience in SCAN, BIST, and ATPG.
  • Strong background in TCL/Perl/Python programming is a must.
  • Expertise in double patterning process nodes is desirable. Experience with sub 40 nM nodes required
  • Expertise in Cadence or Synopsys RTL-to-GDSII flow is preferred.

Expectations

  • Do the FC Floor Plan and Layout
  • Set up the EDA tools and develop the scripts
  • Develop the UPF methodology
  • Implement the Power, Clock Grid
  • Generate the SDF files
  • Do the DRC, ERC, LVS, SI and Cross talk checks, Do the DFM checks
  • Tapeout the chip
  • Manage and mentor the PD and custom layout team
  • Make changes, as needed to the custom layout of the IP
  • Release the GDS2 to the Fabs

Top Skills

Cadence
Gig Ethernet
Lpddr
Mipi
Pcie
Perl
Python
Synopsys
Tcl
Usb2
Usb3

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