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Western Digital

Technologist, ASIC Development Engineering

Posted 6 Days Ago
Be an Early Applicant
Bengaluru, Karnataka
Senior level
Bengaluru, Karnataka
Senior level
The Technologist will lead strategic and technical efforts in semiconductor foundry interface, focusing on power-performance-area-cost modeling, reliability specifications, yield and reliability analysis, and collaboration across engineering teams. This role requires problem-solving skills, understanding of advanced CMOS architecture, and proficiency in statistical modeling and programming.
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Company Description

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description

  • Focused, self-motivated semiconductor foundry interface engineer providing strategic and technical leadership across the semiconductor industry involving wafer foundries and fabless design house.
  • Drive STCO/DTCO power-performance-area-cost (PPAC) modeling and simulation to help qualify the best foundry Technology.
  • Good understanding of advanced CMOS device architecture (FinFET and GAA) and process-design Kits (PDK)
  • Define Reliability specifications to meet the product needs by understanding the customer needs and through closely collaborating with internal product/process development teams.
  • A multi-functional teammate with hands on skills for SPICE and layout tools. Understanding the advanced packaging Technology
  • Specialized in yield and reliability analysis, process flow and integration development, product design and testing optimization to accelerate advanced CMOS technology qualification and mass production ramp-up.
  • Collaborating with integration, module & 3D packaging team (internal and external) to form a clear understanding of the process flow to understand any technology gaps and produce innovative ideas to close the gaps and meet the future needs.
  • Build relationships with suppliers, key stakeholders, senior executives, and multi-functional teams to drive multiple product ramp-up and performance boost projects in fast-paced work environment to meet ambitious timeline.
  • Proven in-depth technical problem-solving and decision-making skills with broad knowledge in electrical / physical (eFA/pFA) and statistical failure analysis to identify root cause, develop and implement corrective and preventive actions in a timely manner.
  • Proficient in statistical computation and modeling skills and sound programming capabilities in Python, JMP and in-house systems.

Qualifications

  • Education: University degree (Master/PhD) in electrical engineering or a comparable subject
  • Personality and working practice: communicative, problem-solving mindset, responsible, initiative, flexible and target oriented. Comfortable in working in a fast paced, dynamic environment with changing priorities.
  • Experience and Knowledge: Minimum 10+ years of experience working with foundry partner, solid understanding of PDK collaterals and deployment in design environments, handling of process and yield related challenges and worked with foundry to negotiate the optimum process and manufacturing cost.Worked with multiple Foundry Vendors TSMC/UMC/Samsung.
  • Qualifications: ability to identify and analyse tasks efficiently within the scope of your work and to develop pragmatic application-specific solutions; pronounced ability to communicate, relevant experience in the methodology of problem solving as well as in the cooperation and leadership of international and cross-functional teams
  • Technical Skills: SVRF/TVF based customization, Perl/Python for automation
  • Languages: fluent in English and German written and spoken

Additional Information

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Top Skills

Python
HQ

Western Digital Bengaluru, Karnataka, IND Office

WMVV+J5H, Kadubeesanahalli, Bengaluru, Karnataka, India, 560103

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