Top Design Engineer Jobs in Bengaluru

Lead RTL micro-architecture and implementation of ultra-low-power communication SoC blocks. Perform RTL linting, simulation, CDC/DRC checks, gate-level simulations, MBIST/DFT integration, ECOs, and power-aware verification using UPF and VCS-NLP. Collaborate with architects, analog teams, and handle timing closure and hardmacro integration.

Design and lead development of miniaturized PCBs for wearable devices using custom Wi-R ICs and COTS components. Create schematics and layouts, perform board-level testing and debugging, collaborate on packaging, and support prototype validation and test automation.

Lead SoC RTL design, integration, implementation, and quality checks across frontend, DFT, verification, and physical design. Own PPA, constraints, clocking, boot, low-power architecture, interfaces, memory subsystems, and chip-level integration. Collaborate with global architecture and engineering teams, mentor engineers, evaluate IPs, support production-quality silicon, and influence technical strategy. The role requires leadership in SoC design and verification, advanced connectivity and processor architectures, and expertise in lint, CDC, RDC, power-aware design, chiplets, and die-to-die technologies.

Creates detailed 2D drawings and 3D CAD models, collaborates with engineers and architects, manages technical documentation and drawing databases, supports design reviews, and identifies innovative solutions. The role requires adaptability, assertive communication, attention to detail, teamwork, and willingness to handle varied responsibilities in a fast-paced startup environment.

Design and develop Class I and II medical devices from concept through commercialization. Responsibilities include CAD modeling, manufacturing drawings, DFMEA, risk assessment, DFM/DFA, prototyping, verification and validation testing, BOMs, engineering documentation, ECN/ECR management, quality issue resolution, and manufacturing support. The role collaborates with industrial design, electronics, manufacturing, quality, and regulatory teams while ensuring compliance with medical device standards.

Design, analyze, and tape-out low-power mixed-signal and RF circuits for wearable communication chips. Integrate analog IP into SoCs, verify and validate designs, collaborate with firmware/board/testing teams, and perform lab validation from schematic through layout and tape-out.

Design and develop mechanical components and enclosures using CAD. Create 3D models, assemblies, and manufacturing drawings. Support prototyping, vendor coordination, tolerance analysis, material selection, manufacturability, field testing, and documentation while collaborating with electronics and hardware teams.

Leads mechanical and fluid-control system design, verification, validation, reliability, safety, and regulatory testing. Develops protocols, conducts analyses, documents results, manages change controls and CAPA, and supports risk mitigation. Integrates mechanical, electrical, and consumable components while optimizing plastic designs for manufacturing, cost, reliability, and compliance. Leads project teams, laboratory activities, manufacturing transitions, and subsystem deliverables.

Develop and maintain production-ready electrical schematics, PCB layouts, drawing templates, component libraries, BOMs, and approved alternate parts lists. Review designs for integrity, manufacturability, testability, and documentation completeness. Coordinate with procurement, manufacturing, quality, and engineering teams to resolve component and production issues while maintaining engineering changes, revisions, and accurate product records.

Lead architecture and RTL development for UALink IP and subsystems. Translate protocol requirements into scalable hardware architectures, design high-bandwidth low-latency datapaths and control logic, and optimize performance, power, area, and latency. Develop and review SystemVerilog RTL, collaborate with verification, physical design, integration, and firmware teams, debug complex issues, contribute to architecture decisions, and mentor engineers.

Lead the architecture, microarchitecture, RTL design, integration, and silicon bring-up of complex connectivity IP and subsystems. Develop high-performance logic using SystemVerilog/Verilog, addressing flow control, ordering, buffering, arbitration, error handling, and reliability. Optimize performance, latency, area, and power; collaborate with verification, SoC integration, and physical design teams; debug post-silicon issues; lead technical reviews and mentor engineers.

Design, analyze, optimize, and validate precision optical systems for Earth observation satellite payloads. Responsibilities include optical requirements definition, Zemax modeling, tolerancing, stray-light mitigation, manufacturing and opto-mechanical integration support, testing, documentation, and vendor coordination. The role supports designs from concept through manufacturing, integration, and verification while balancing technical, schedule, and budget constraints.

Lead the end-to-end development of Earth observation imaging payloads, including payload architecture, optical and opto-mechanical design, requirements, integration, verification, testing, image quality analysis, launch preparation, and in-orbit calibration. Coordinate subcontractors, collaborate with satellite platform teams, manage performance budgets, and drive feasibility studies and future optical payload technology programs.

Leads RTL and microarchitecture development for UALink IP and subsystems, designing high-performance control and data-path logic for scalable, low-latency interconnects. Responsibilities include buffering, arbitration, flow control, ordering, error handling, optimization, SystemVerilog development, debugging, silicon support, cross-functional collaboration, RTL review, and mentoring engineers.

Lead end-to-end antenna and phased-array architecture for a spaceborne SAR payload, including electromagnetic design, simulation, analytical validation, beamforming coordination, RF-thermal-mechanical analysis, measurement, environmental qualification, integration, and in-orbit support. The role requires deep antenna theory, phased-array expertise, antenna testing experience, technical documentation skills, and cross-functional collaboration. The engineer will also mentor junior staff and support flight qualification.

Lead RF/analog/mixed-signal chip tapeouts from design through validation, integrate analog IPs into SoCs, prototype high-speed systems, mentor the team, validate silicon with test automation, and contribute to PCB design and firmware bring-up for wearable devices.

Perform RTL integration of IPs and subsystems into top-level SoCs, develop RTL wrappers, interconnect, clock/reset infrastructures; run lint/CDC/early synthesis checks; debug simulation and synthesis issues; automate and maintain integration flows with Python/Perl/Tcl; collaborate with design, verification, and physical design teams and contribute to design reviews and documentation.

Lead mechanical design for consumer electromechanical products from concept through production. Responsibilities include CAD modeling, prototyping, testing, thermal/fluid/structural analysis, cross-functional collaboration, DFM/DFA, tolerance analysis, and manufacturing ramp support in Asia. The role requires designing plastic, metal, and soft goods components integrated with sensors and actuators, supporting high-volume manufacturing, and traveling to China as needed.

Leads the mechanical design, analysis, optimization, manufacturing support, commissioning, and continuous improvement of high-pressure, high-temperature tubular and plug flow reactors. Responsibilities include pressure vessel design, FEA and stress analysis, materials selection, mechanical integrity assessments, vendor and fabrication support, code compliance, troubleshooting, root cause analysis, technical reviews, mentoring engineers, and client discussions across chemical and process industries.

Leads end-to-end hardware architecture and development for high-reliability airborne and space electronics. Responsibilities include component selection, power architecture, schematic and PCB design, embedded processor and peripheral integration, vendor coordination, hardware bring-up, debugging, testing, compliance, and technical documentation. The role requires expertise in power supplies, high-speed interfaces, RF circuits, signal and power integrity, EMI/EMC-compliant layouts, and collaboration with firmware and cross-functional teams.

Design multilayer PCBs for satellite systems, including component placement, stackup configuration, high-speed and power routing, design-rule management, and DFM, DFA, and DFT compliance. Create and maintain IPC-compliant footprints and libraries, understand PCB fabrication processes, and produce manufacturing outputs such as Gerbers, drill files, BOMs, pick-and-place data, and assembly drawings.

Design and deliver complex, manufacturable PCB reference and system platforms for Mythic silicon. Lead schematic design, PCB layout guidance, SI/PI reviews, fabrication documentation, vendor coordination, bring-up, debug, validation, and production handoff, ensuring power, clocking, connector, mechanical, thermal, and manufacturing constraints are met.

Design high-performance analog-to-digital and digital-to-analog converters, evaluate silicon, and oversee layout in advanced CMOS processes.

The role involves automating high-performance analog-to-digital and digital-to-analog converters, leading the Automation Compiler Team, and transforming manual designs into parameterized forms. Strong understanding of mixed-signal design and coding skills, preferably in Python and Skill, are required along with over 5 years of IC development experience.

Design and verify digital datapaths for high-performance ADCs and DACs using RTL, assist with synthesis and timing closure, and automation through scripting.